PRODUCT

WS-486 Series (Water-Soluble Solder Cream)
Polyethylene Glycol and Halide Free

The 486 Series is a fourth generation product designed for SMT assemblies where post reflow cleaning is performed with water alone. This non-resin formula was developed to replace earlier water-soluble creams, containing no insoluble components. Excellent printability and stencil life is obtained for the most demanding applications, including hard-to-solder metalizations and harsh operating environments.

SPECIAL PROCESSING PROPERTIES

• Stencil Life: 6-8 hours.
• Tack time: 6-8 hours before or after placing components.
• Excellent print definition, no slump.
• Minimal clear residue after reflow.
• Very bright solder fillets, after cleaning, no visible residues under magnification.

RECOMMENDED CLEANING

40-50 PSI at 50-60° C. Rough rinse cycle of soft water. Final rinse of DI water. No saponifier or other chemicals needed.

CREAM PROPERTIES

While SIR and IONIC contamination results will vary with board design, component density and cleaning machine efficiency, the following results are typical of the 400 Series creams.

Ionic Contamination:

• 1.0-3.5 µ g NaCl eq./Sq. in.

SIR:

• Control Board: 4.5x10E10
  Cleaned: 6.38x10E9
  IPC-SF-818 B25 Class 1, 2 168 hrs.

Copper Mirror:

• Pass IPC-SF-818

Silver Chromate Paper Test:

• Pass IPC-SF-818

Water Extract Resistivity:

• over 1x10E5 ohm/cm
  MIL-F-14256F

Tackiness vs. Time Exposure:

(Chatillion force guage IPC-SF-819

Time (hrs) 0 2 4 8

Force (grams) 40 46 52 39

Viscosity

• Viscosity is dependent upon alloy, metal loading and particle size distribution. For 63/37, T3, 89% the viscosity (+/- 10%) is 280kcps (Malcom), 850kpcs (Brookfield).
• The 486 Series is available in 63/37 and 62/36/2Ag in both fine pitch (type 3) and ultra fine pitch (type 4).