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NC-557
No-Clean Solder Cream
Technical Data Sheet		 back to No-Clean


PRODUCT

NC-557 Series (No-Clean Solder Cream)
VOC free and Non-Hygroscopic

The 557 Series is designed to meet requirements for reliable solder joints in SMT PC Board assemblies. This cream was formulated to replace RMA and water soluble solder creams with the benefits of eliminating the added steps of potentially hazardous and costly solvent cleaning and DI water cleaning. This formula was designed to have a wider process window and better compatibility with OSP's than previous No-Clean formulations.


SPECIAL PROCESSING PROPERTIES

  • Stencil Life: 6-8 hours.
  • Tack time: 6-8 hours before or after placing components.
  • Clear, minimal, non-tacky conformal coating (glass-like) after reflow. Conformal coating is non-ionic, non-conductive and non-hygroscopic.
  • Touch-up is very easy with the use of one of our 500 Series fluxes.

CREAM PROPERTIES

Copper Mirror

  • Pass (Type L)
    Bellcore TR-NWT-000078 secs. 13.1.1, IPC-SF-818 secs. 3.2, 4.4.31 and Table, and IPC - TM - 650 method 2.3.32

Silver Chromate Paper Test:

  • Pass
    Bellcore TR-NWT-000078 secs. 13.1.1 IPC-SF-818
    secs. 4.4.3.2, IPC-TM-650 secs. 2.3.33

SIR:

  • 6.42x10E11 24 hrs.
    1.66x10E13     96 hrs.
    Bellcore TR-NWT-000078 secs. 13.1.3.9 through 13.1.3.9 and 13.1.4 through 13.1.4.2.9. minimum 2x10E10

Water Extract Resistivity:

  • over 2.67x10E5 ohm/cm
    MIL-F-14256F

Viscosity

  • Viscosity is dependent upon alloy, metal loading and particle size distribution. For 63/37, T3, 90% the viscosity (+/- 10%) is 200kcps (Malcom), 800kpcs (Brookfield).

Ionic Contamination

  • Less than 8.8 µg NaCl/sq. in. (1.364 µg NaCl/sq. cm.)

Printability

  • The NC-557 No-Clean Series offers excellent printability from 50 mil to 15 mil spacing.

RECOMMENDED REFLOW

  • Smooth ramp for preheat.
  • Peak reflow at 205-230° C


For additional information contact LICO direct at +43 1 706 43 000.

Samples

This information contained herein is based on technical data which we believe to be reliable and is intended for use by persons having technical skill, at their own discretion and risk. Users of our products should make their own tests to determine the suitability of each such product for their own particular process. AMTECH will assume no liability for results obtained or damages incurred through the application of the data presented.

© 1995-2000 AMTECH Inc.