WS-488 Wasserwaschbare Lötcreme Technisches Datenblatt |
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WS-488 Serie (Wasserwaschbare Lötcreme) The 488 Series is a fourth generation product designed for SMT assemblies where post reflow cleaning is performed with water alone. This non-resin formula was developed to replace earlier water-soluble creams, containing no insoluble components. This formulation is based on the popular WS-486, with slight modifications to increase the production window. Excellent printability and stencil life is obtained for the most demanding applications, including hard-to-solder metalizations and harsh operating environments.
RECOMMENDED CLEANING 40-50 PSI at 50-60° C. Rough rinse cycle of soft water. Final rinse of DI water. No saponifier or other chemicals needed. CREAM PROPERTIES While SIR and IONIC contamination results will vary with board design, component density and cleaning machine efficiency, the following results are typical of the 400 Series creams. Ionics:
SIR:
Copper Mirror:
Halide %:
Water Extract Resistivity:
Tackiness vs. Time Exposure:
Viscosity
Handling and Storage: The 488 series will have a minimum shelf life of three months when stored below 75° F. This can be extended to six months or more if temperature is maintained below 40° F. Always allow creams to naturally reach room temperature before opening (minimum of 12 hours). Stir for 2-3 minutes before using. Do not put used cream back in jar with unused cream. The 486 Series is available in 63/37 and 62/36/2Ag, in both fine pitch (type 3) and ultra fine pitch (type 4). |
RECOMMENDED REFLOW
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For additional information contact your local AMTECH representative or call the Technical Service department direct at LICO +43 1 706 43 000.
This information contained herein is based on technical data which we believe to be reliable and is intended for use by persons having technical skill, at their own discretion and risk. Users of out products should make their own tests to determine the suitability of each such product for their own particular process. AMTECH will assume no liability for results obtained or damages uncurred through the application of the data presented.
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