Alterungsbeständigere
Lotpulver von
AMT, dem Weltmarktführer in Lotpulver
MAXON POWER SOLDER ist ein wichtiger Schlüssel um die Zuverlässigkeit von elektronischen Geräten zu erhöhen. Die Ursache von Lötstellenausfällen ist in den betriebsmäßigen Zyklen wie Strom und Temperatur zu suchen. Die Ursache einer zerstörten Lötstelle ist im Gegensatz der thermischen Ausdehnungskoeffizienten der einzelnen Materialien zu finden, welche durch Strom und Temperaturzyklen hervorgerufen werden. Zwei Arten von Tests, mechanische und thermische Alterungstests haben gezeigt, dass MAXON bis zu 7x längere Lebenszeiten der Lötstelle aufweisen kann, als traditionelle eutektische Zinn-Blei-Lote
MAXON bietet eine exzellente Alterungsbeständigkeit mit den hervorragenden Verarbeitungseigenschaften eines traditionellen eutektischen Zinn-Blei-Lotes höchster Qualität.
Durch die heutige High-Speed-Produktion von fortschrittlichen Leiterplatten, wird von den Bauelementen und Lötstellen nicht nur die zuverlässige Kontaktierung und Stromleitfähigkeit verlangt, sondern auch vermehrt strukturelle mechanische Festigkeit. MAXON-Lötcreme bietet verschiedene Vorteile wie eine verlängerte Lebenserwartung der Lötstellen, verbunden mit der Möglichkeit größere SMD-Bauelemente, mechanisch ausschliesslich über Fine-Pitch-Lötstellen mit den Lötpads zu verbinden.
MIKROSTRUKTURELLE INNOVATION
Mechanical tests of surface mounted leadless chip carrier joints
were conducted at room temperature under cycle in both tensile
and shear conditions. Thermal fatigue resistance was demonstrated
by MIL-STD thermal cycling joints lasted longer due to microstructural
refinement of the solder alloy.
In traditional Sn-Pb solder, excessive microstructural coarsening of a soldered joint is caused by inhomogeneous solder deformation during thermal cycling. Coarsening is the precursor to crack initiation, growth and the subsequential failure joint. The microstructural ratio of stability to strain distribution dictates the degree pf coarsening, which is a function of the uniformity fineness of particles in the structure. Refinement of MAXON's metallurgical microstructure substantially eliminates structural irregularities.
Unique dopant alloying has created a superplastic alloy with a uniformly fine and equiaxed grain. The dopants modify the constitutional supercooling during solidification. The resultant fine grain suppresses the coarsening kinetics of the solder under fatigue conditions.
The potential applications for MAXON are as broad as those for traditional Pb-Sn eutectic solder. Manufacturers of electronics who use MAXON, especially those who require high reliability or high densities in electronic systems will benefit through increased customer satisfaction, lower manufacturing costs and lower warranty returns cost.
Because MAXON's reflow temperatures and processing behavior effectively match those of traditional solders, your existing processing methods, equipment and conditions can be used without interrupting production.
TENSILE TESTING
Specimens of MAXON and traditional solder were fabricated for
testing under a cyclic sawtooth stress wave form at 0.001 Hz with
a peak tensile stress at 110% of the generic yield of Sn-Pb eutectic
solder. MAXON survived approximately seventeen times longer compared
to the number of cycles to failure for traditional solder.
SHEAR TESTING
Collar-pin torsion test speciments of cylindrical OFHC copper
rods joined by MAXON and traditional Sn-Pb solder were fabricated,
cleaned and measured for torsion fatigue testing. The cycling
frequency was 0.01 Hz and the plastic strain range per cycle applied
on the solder was approximately 10%. The average shear-failure
of MAXON was six times longer than the traditional Sn-Pb eutectic
solder.
THERMAL TESTING
Thermal fatigue resistance of MAXON was evaluated by thermal cycling
tests on surface mounted leadless chip carrier joints. Specimen
assemblies were fabricated for testing using MAXON and traditional
Sn-Pb solder pastes. The assemblies were tested under thermal
cycling conditions cited in MIL-STD. The integrity of all joints
was periodically examined under binocular stereoscope. The points
of joint failures were determined as functions of the number of
thermal cycles. Thermal fatigue resistance of MAXON joints was
five to seven times better than traditional solder.
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